Reaction Bonded Silicon Nitride
Reaction Bonded Silicon Nitride
Reaction Bonded Silicon Nitride is quite unique in its manufacture and ability to take advantage of ‘near-net shape’ forming. Components are initially made from very high purity Silicon metal and formed to the desired geometry using a variety of techniques (see table below). Parts are then fired in a Nitrogen controlled environment, which converts the Silicon metal to Si3N4 ceramic, retaining about 20% porosity. Once converted, the component can be further machined to achieve an improved surface finish using specialised diamond tooling. There are no sintering aids used in the manufacture of RBSN leading to the final ceramic having very high purity (>99% Si3N4). Also there is minimal shrinkage during the entire process (~0.1%) and very accurate dimensions can therefore be achieved cost effectively.
Features of Reaction Bonded Silicon Nitride
- High purity (>99%) Si3N4
- Low weight
- Excellent Thermal Stability
- Sputter resistant
- Not wetted by many metal and alloys
- Excellent thermal shock capability (ie; cycles from RT to 700°C in 7 seconds and repeated every 30 seconds)
